With the rapid development of science and technology, micron-level machining accuracy has been more and more widely used in various fields, especially in high-end manufacturing industries such as aerospace, electronic products, medical equipment, etc., with higher and higher requirements for machining accuracy. In 2024, it is expected that the micron-level machining accuracy will reach a new height, making the application of laser cutting technology enter a new stage.
The basic principle of micron-scale laser cutting is to use a highly focused laser beam to irradiate the material, so that the material is quickly heated up locally and achieve precise material removal or cutting. Its key technologies mainly include:
Micron-level laser cutting requires the use of pulsed lasers with peak power of up to kilowatts or even 10,000 watts, and commonly used lasers are silicon carbide (SiC) lasers, fiber lasers, etc. A laser beam with a high power density can quickly heat the material to a melting or vaporization temperature.
By using a numerically controlled focusing mechanism, the laser can be precisely focused in the range of 0.1 microns, and a very small spot can be obtained, enabling high-precision processing.
The numerical control system can accurately control the position of the laser head and the beam parameters, and process according to the set path and process parameters to realize the cutting of complex shapes.
Auxiliary processing gas supply system In order to protect and guide the laser beam, inert gases such as helium and argon are often used to purge the processing area to avoid negative effects on processing quality such as oxidation.
High-speed cameras, thermal imagers and other equipment are used to monitor the processing process, and feedback and adjust the laser parameters to achieve closed-loop control, so as to ensure the processing quality.
Micron-level laser cutting technology combines optics, mechatronics, digitalization and intelligent technology, so that laser processing has entered a new stage of high precision.
Micron-level machining accuracy is an indispensable key technology for many high-tech products, which is directly related to the performance and quality of products. The aerospace field has extremely high requirements for material processing accuracy, such as jet engine blades, rocket engine nozzles, etc., which require micron-level or even higher processing accuracy to ensure the safety and reliability of products. Surgical instruments, mechanical hearts, and artificial joints in the medical industry also require high manufacturing precision.
With the development of science and technology, micron-level processing will be widely used in more fields in the future, opening up more possibilities for new products. Achieving higher precision means that smaller, more complex parts can be manufactured, which can lead to a boom in new high-tech industries such as nanotechnology and ultra-high-speed computing.
Experts predict that by 2024, the accuracy of micron-level machining will be significantly improved, and the cutting accuracy can reach 0.1 microns (0.001mm/0.0254inch) or less. This is mainly due to the following technological advancements:
The working accuracy and repeatability of the laser cutting machine have been greatly improved. With the optimization of hardware such as positioning system and transmission system, the working accuracy of the cutting machine can reach the sub-micron level.
More precise application of laser beam positioning technology. The imaging optical system and advanced beam modulation device can achieve nanoscale laser beam positioning.
Application of advanced process monitoring technology. High-speed cameras, sensors and other equipment are used to monitor and feedback the cutting process in real time to ensure processing quality.
The use of intelligent software. Intelligent algorithms can accurately calculate the ideal cutting path and parameters, greatly improving accuracy.
The use of new materials and coated optics. New materials such as silicon carbide lenses can handle higher power and more precise laser beams.
Laser cutting technology with micron-level precision can be widely used in various fields that require extremely high processing accuracy:
It is used to cut high-precision parts such as jet engine blades and rocket engine nozzles, which require very high material processing accuracy and require micron-level or even nano-level processing quality.
It is used for cutting silicon wafers, making printed circuit boards, cutting flexible circuit boards, etc., and its processing accuracy directly affects the performance of electronic products.
It is used to manufacture various precision surgical instruments, prostheses, implants, etc., and has extremely high requirements for processing quality.
It is used to manufacture precision molds such as optical components to improve product accuracy.
It is used in the manufacture of small electromechanical components such as miniature sensors, miniature pumps, and miniature gears.
It is used for high-precision cutting of traditional difficult-to-process materials such as ceramics, glass, and insulating materials.
It is used to make optical components such as gratings and microlenses, and the processing accuracy is required to reach the nanometer level.
Ultra-high-precision laser cutting technology can be used to make high-end jewelry and precision crafts, and fine cutting technology can create complex and delicate designs, increasing the added value of crafts.
Laser cutting with micron-level precision will promote the development of high-end equipment manufacturing industry, enable efficient and precise processing in more fields, and open up a new direction of unlimited applications.
Richconn's strengths in ultra-high-precision laser cutting are multifaceted, making us a leader in the industry. Here are some of our significant advantages in ultra-high-precision laser cutting:
Richconn is committed to introducing and updating advanced laser cutting technology and equipment. We have adopted the latest generation of laser cutting machines, equipped with high-power laser light sources and sophisticated optical systems to ensure ultra-high-precision cutting on a wide range of materials.
Richconn has built highly automated production lines that have improved production efficiency and consistency by introducing automated loading and unloading systems. This allows us to meet the needs of large-scale production and ensure consistent product quality.
We have a strong engineering team with strong technical strength, focusing on the optimization and innovation of the laser cutting process. Through continuous research and practice, this team ensures that we are able to provide the most advanced and efficient cutting solutions.
Richconn's ultra-high-precision laser cutting equipment covers a wide range of materials, including metal alloys, plastics, ceramics, and more. Our experience in handling different materials ensures that we offer a diverse range of cutting services to our customers.
We understand that each customer has unique needs and therefore offer highly customized laser cutting services. From the design phase to production, we work closely with our customers to ensure that products meet their specific specifications and requirements.
Richconn has established a complete quality control and testing system to ensure that every step of the production process meets high quality standards through strict material inspection, cutting process monitoring and quality inspection of the final product.
Overall, Richconn's strengths in the field of ultra-high-precision laser cutting lie in the advanced technical equipment, the efficiency of automated production, the technical strength of the engineering team and the comprehensive coverage of multi-material cutting and customized services. We are committed to providing customers with excellent laser cutting solutions to meet the needs of different industries.
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